;
To main content To menu
You are browsing the Global site. Products and information are based on this region.
  • Productos
  • Abrasives
  • Ultra Premium Micron Powder Diamond

Ultra Premium Micron Diamond Powder

Synthetic premium micron diamond processed uniquely to detect and remove oversized particles, delivering exceptional lapping and polishing performance.
Ultra Premium Micron Diamond Powders.jpg

Ultra premium micron diamond powders (UPM) are high-quality synthetic diamond powders designed to minimize costly chipping and scratching issues in precision processes, such as processing silicon and silicon carbide semiconductor wafers for chip making. UPM diamond powders exhibit the industry's most tightly controlled size, shape, and surface properties, resulting in superior reproducibility.

Derived from synthesized monocrystalline diamonds, these ultra-premium products are grown under conditions that create uniform crystals that resist fracturing and have excellent impact resistance. Hyperion's advanced manufacturing process has continuously improved to deliver a product with unparalleled performance in detecting and removing oversized particles, which is a critical feature for customers with precise tooling applications in the semiconductor markets.

Oversized particles can be extremely difficult to detect with traditional particle size detection techniques because they exist in such low amounts. It's essential to find oversized particles because they can cause chipping, scratching, and imperfections in the wafer, which can lead to a total loss of the wafer and result in the loss of hundreds of chips. Hyperion innovatively developed the UPM grade to help detect these oversized particles in ppb concentrations and efficiently remove them, ensuring a high-quality end product and significant cost avoidance.

Available in standard diamond size fractions and customizable to meet specific surface cleanliness requirements, UPM powders allow semiconductor manufacturers to use thinner dicing blades to cut wafers. This results in less chipping and material loss, producing a higher yield of electrical components from each wafer. Back-grinding wheels with UPM result in wafers with fewer scratches and superior surface finishes.

 

 

Products

Hyperion Micron diamond

Ultra Premium Micron Diamond Powder

Hyperion Code: UPM

Description: Synthetic ultra premium micron diamond powder is designed for processes where a precise size range and consistency are key. Designed for exceptional performance when back-grinding, dicing, and other precision machining of silicon and semiconductor wafers. 

Sobre Ultra Premium Micron Diamond Powder

Ultra Premium Micron Benefits

 

Due to the industry's most tightly controlled size, shape, and surface properties, Hyperion's UPM diamond powders exhibit several benefits for precision machining applications. The ultra-precise particle size distribution produces superior reproducibility, minimizing chipping and material loss and providing higher production yields.

 

Ultra Premium Micron Applications

 

UPM is designed for precision machining applications due to its low levels of oversized particles, essential for achieving the required precision, surface finish, and dimensional accuracy. The uniformity and sharpness of the diamond parts allow for controlled material removal and minimal subsurface damage, resulting in high-quality precision machined parts for semiconductors, microelectronics, optics, photonics, medical devices, aerospace components, and mold and die making. 

Micron Products Catalog

Otros Product Groups

Conocer más
Conocer más
Conocer más
Conocer más